Quantum Research Institute | Heterogeneous Materials Integration for Photonic Integrated Circuits

In-Person: Duderstadt 1180 (North Campus)
Zoom: https://umich.zoom.us/j/95879021951?jst=2

Abstract
Wafer-bonding is a key enabling technology for the development of complex photonic integrated circuits (PICs) that utilize the best properties of various materials. III-V semiconductors are especially important for such PICs because they offer a wide variety of bandgaps, very high gain under electrical injection, large optical nonlinearity, and wide transparency regions. I will describe some of the projects done by the Quantum Nanophotonics Group at NIST/Boulder over the past several years that utilize wafer-bonding to make novel optoelectronic devices, including chip-scale nonlinear optics and the demonstration of integrated semiconductor lasers at wavelengths less than 1000 nm.