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Quantum Research Institute | Heterogeneous Materials Integration for Photonic Integrated Circuits

Prof. Richard Mirin - University of California Santa Barbara
Friday, July 17, 2026
11:00 AM-12:00 PM
Virtual
In-Person: Duderstadt 1180 (North Campus)
Zoom: https://umich.zoom.us/j/95879021951?jst=2

Abstract
Wafer-bonding is a key enabling technology for the development of complex photonic integrated circuits (PICs) that utilize the best properties of various materials. III-V semiconductors are especially important for such PICs because they offer a wide variety of bandgaps, very high gain under electrical injection, large optical nonlinearity, and wide transparency regions. I will describe some of the projects done by the Quantum Nanophotonics Group at NIST/Boulder over the past several years that utilize wafer-bonding to make novel optoelectronic devices, including chip-scale nonlinear optics and the demonstration of integrated semiconductor lasers at wavelengths less than 1000 nm.
Building: Off Campus Location
Location: Duderstadt Building, Room 1180
Event Link:
Event Type: Workshop / Seminar
Tags: Applied Physics, Astronomy, Chemistry, Computer Science And Engineering, Electrical And Computer Engineering, Electrical Engineering And Computer Science, Materials Science, Physics, Quantum, Quantum Computing, Quantum Science
Source: Happening @ Michigan from Quantum Research Institute, Department of Astronomy, Department of Physics, Electrical and Computer Engineering, Applied Physics, Department of Chemistry, Materials Science and Engineering, Electrical Engineering and Computer Science, Quantum Research Institute